• формат pdf
  • размер 35.63 МБ
  • добавлен 17 декабря 2011 г.
Datta M., Osaka T., Schultze J.W. (Eds.) Microelectronic Packaging
CRC Press, 2005, 536 pages.

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.

Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alteative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.
Смотрите также

Campbell S.A. The Science and Engineering of Microelectronic Fabrication

  • формат pdf
  • размер 25.07 МБ
  • добавлен 18 декабря 2011 г.
Oxford University Press, 2 edition, 2001, pages: 603. Ideal for upper-level undergraduate or first-year graduate courses and as a handy reference for professionals, The Science and Engineering of Microelectronic Fabrication, Second Edition, provides a thorough and accessible introduction to the field of microfabrication. Revised and expanded in this second edition, the text covers all the basic unit processes used to fabricate integrated circui...

Chang C.Y., Sze S.M. ULSI Technology

  • формат djvu
  • размер 7.17 МБ
  • добавлен 17 декабря 2011 г.
The McGraw-Hill Companies, 1996, 726 Pages. This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter...

Delaney K. (Ed.) Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects

  • формат pdf
  • размер 10.33 МБ
  • добавлен 11 ноября 2011 г.
Springer Science + Business Media, 2008, Pages: 421 This book investigates the development of networkable smart objects for Ambient Intelligence (AmI) with specific emphasis upon the implementation of the microsystems and nanoscale devices required to achieve effective smart systems. In this context, it seeks to investigate the challenges and potential solutions that will ensure the technology platforms are created to be capable of being seamle...

Gomez E.S. (ed.) Piezoelectric Ceramics

  • формат pdf
  • размер 28.48 МБ
  • добавлен 19 сентября 2011 г.
Sciyo. 2010. 302 p. Preface Piezoelectric thin film deposition: novel self assembled island structures and low temperature processes on silicon Investigation of elevated temperature effects on multiple layer piezoelectric ultrasonic transducers with adhesive bondlines by self-heating Modelling shear lag phenomenon for adhesively bonded piezo- transducers Characterization of properties and damage in piezoelectrics Analysis of mechanical and elect...

Hartzell A.L., Silva M.G., Shea H.R. MEMS Reliability

  • формат pdf
  • размер 10.34 МБ
  • добавлен 11 апреля 2011 г.
Springer, 2011. 304 p. ISBN-10:1441960171 The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by address...

Jaeger R.C. Introduction to Microelectronic Fabrication: Volume 5

  • формат djvu
  • размер 4.27 МБ
  • добавлен 22 января 2012 г.
Prentice Hall; 2 edition, 2002, ISBN: 0201444941, 316 pages Modular Series on Solid State Devices This introductory book assumes minimal knowledge of the existence of integrated circuits and of the terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors. It presents to readers the basic information necessary for more advanced processing and design books. Focuses mainly on the basic processes used...

Qin Y. Micromanufacturing Engineering and Technology

  • формат pdf
  • размер 16.42 МБ
  • добавлен 17 декабря 2011 г.
William Andrew, Elsevier, 2010, 414 pages. This book presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering. It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with a...

Stephen Beeby, Graham Ensell, Michael Kraft, Neil White. MEMS Mechanical Sensors

  • формат pdf
  • размер 13.94 МБ
  • добавлен 26 марта 2010 г.
Artech House, 2004, 281 p. Here's the book to keep handy when you have to overcome obstacles in design, simulation, fabrication and application of MEMS sensors. This practical guide to design tools and packaging helps you create the sensors you need for the full range of mechanical microsensor applications. Critical physical sensing techniques covered include piezoresistive, piezoelectric, capacative, optical, resonant, actuation, thermal, and m...

Tan C.S., Gutmann R.J., Reif L.R. Wafer Level 3-D ICs Process Technology

  • формат pdf
  • размер 14.31 МБ
  • добавлен 08 ноября 2011 г.
Springer, 2008. - 422 p. (Series in Integrated Circuits and Systems). Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researchi...

Zhou Y. Microjoining and Nanojoining

  • формат pdf
  • размер 37.05 МБ
  • добавлен 19 сентября 2011 г.
Woodhead Publishing Limited, 2008, 810 pages Many recent advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part 1 reviews the basics of microjoining, includin...