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Delaney K. (Ed.) Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects
Springer Science + Business Media, 2008, Pages: 421

This book investigates the development of networkable smart objects for Ambient Intelligence (AmI) with specific emphasis upon the implementation of the microsystems and nanoscale devices required to achieve effective smart systems. In this context, it seeks to investigate the challenges and potential solutions that will ensure the technology platforms are created to be capable of being seamlessly integrated into everyday objects. In particular, this includes the requirements and possibilities for integrated computation and MEMs sensors, embedded microelectronic electronics sub-systems, including the System-in-Package (SiP) and Multi-Chip Module (MCM), as well as novel assembly techniques for autonomous MEMs sensors.
Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects. In particular, it deals with the requirements for integrated computation and MEMs sensors, system-in-a-package solutions, and multi-chip modules. On top of this, the publication’s 500 pages cover the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, and practical performance issues that are key to the AmI concept.
This book also includes chapters describing technology platforms that are specifically important to the creation of smart objects (and indeed AmI itself), including sensor subsystems development (for example, using toolkits), wireless networking technologies and systems-level software.
Finally, there is the practical issue of creating Smart Systems. Finding solutions to the challenges of building networkable smart objects is best researched by prototyping them; often, a process where multiple prototypes will be build, offers the greatest insight. Three approaches to investigating, building and demonstrating prototypes are presented.
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