Статья. Опубликована в журнале "Industrial Diamond Review". – 2004.
– № 3 – P. 45-48.
Авторы: Khomich M., Aliakseyev Y., Demmert A., Pahler D., Dambon
O., Schneider U.
Статья на английском языке.
Название на русском языке: Магнитно-абразивная обработка кремниевой
пластины - новый подход.
Аннотация к статье на английском языке:
Smooth surfaces are a common goal in production engineering that differs substantially in its consequences with regard to the subsequent use of the workpiece. One such example is the surface machining of silicon wafers preparing the wafers for further use in the IC-production, where silicon wafers are the foundation of any microelectronic device. This article is conceed w i th a novel approach in the manufacture of silicon wafers by means of magnetic-abrasive machining (MAM). The expected advantages of MAM are comparably minor machine requirements, inexpensive abrasive tools and superior surface qualities.
Smooth surfaces are a common goal in production engineering that differs substantially in its consequences with regard to the subsequent use of the workpiece. One such example is the surface machining of silicon wafers preparing the wafers for further use in the IC-production, where silicon wafers are the foundation of any microelectronic device. This article is conceed w i th a novel approach in the manufacture of silicon wafers by means of magnetic-abrasive machining (MAM). The expected advantages of MAM are comparably minor machine requirements, inexpensive abrasive tools and superior surface qualities.