• формат djvu
  • размер 4.27 МБ
  • добавлен 22 января 2012 г.
Jaeger R.C. Introduction to Microelectronic Fabrication: Volume 5
Prentice Hall; 2 edition, 2002, ISBN: 0201444941, 316 pages

Modular Series on Solid State Devices

This introductory book assumes minimal knowledge of the existence of integrated circuits and of the terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors. It presents to readers the basic information necessary for more advanced processing and design books. Focuses mainly on the basic processes used in fabrication, including lithography, oxidation, diffusion, ion implementation, and thin film deposition. Covers interconnection technology, packaging, and yield. Appropriate for readers interested in the area of fabrication of solid state devices and integrated circuits.
Смотрите также

Campbell S.A. The Science and Engineering of Microelectronic Fabrication

  • формат pdf
  • размер 25.07 МБ
  • добавлен 18 декабря 2011 г.
Oxford University Press, 2 edition, 2001, pages: 603. Ideal for upper-level undergraduate or first-year graduate courses and as a handy reference for professionals, The Science and Engineering of Microelectronic Fabrication, Second Edition, provides a thorough and accessible introduction to the field of microfabrication. Revised and expanded in this second edition, the text covers all the basic unit processes used to fabricate integrated circui...

Chang C.Y., Sze S.M. ULSI Technology

  • формат djvu
  • размер 7.17 МБ
  • добавлен 17 декабря 2011 г.
The McGraw-Hill Companies, 1996, 726 Pages. This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter...

Datta M., Osaka T., Schultze J.W. (Eds.) Microelectronic Packaging

  • формат pdf
  • размер 35.63 МБ
  • добавлен 17 декабря 2011 г.
CRC Press, 2005, 536 pages. Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metal...

Gad-el-Hak M. (Ed.) MEMS: Design and Fabrication

  • формат pdf
  • размер 43.5 МБ
  • добавлен 18 декабря 2011 г.
CRC Press, Taylor & Francis Group, 2 edition, 2006, 647 pages. As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection of MEMS knowledge available, p...

Ghodssi R., Lin P., MEMS Materials and Processes Handbook

  • формат pdf
  • размер 26.97 МБ
  • добавлен 25 марта 2011 г.
Springer, 2011. 1185 p. ISBN: 0387473165 MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate material...

MEMS introduction and fundamentals 2006

  • формат pdf
  • размер 16.73 МБ
  • добавлен 09 ноября 2011 г.
MEMS: Introduction and Fundamentals covers the theoretical and conceptual underpinnings of the field, emphasizing the physical phenomena that dominate at the micro-scale. It also explores the mechanical properties of MEMS materials, modeling and simulation of MEMS, control theory, and bubble/drop transport in microchannels. Chapters were updated where necessary, and the book also includes two new chapters on microscale hydrodynamics and lattice B...

Microwave Journal 2011 №03

  • формат pdf
  • размер 35.78 МБ
  • добавлен 10 июля 2011 г.
Contents: Introduction by Peter Staecker, Chairman, 1991 MTT-S Boston Symposium; Compiled by David Vye, Microwave Journal Editor. A brief retrospective of some of the more memorable editorial contributions from Microwave Journal’s co-founder and longtime editor, Ted Saad. David Vye, Microwave Journal Editor. Technologists from Agilent, LeCroy, Rohde & Schwarz and Tektronix explore the state of multi-GHz oscilloscopes. Agilent Technologies Inc...

Microwave Journal 2011 №11

  • формат pdf
  • размер 187.96 МБ
  • добавлен 11 января 2012 г.
Contents: David Vye, Microwave Journal Editor. In-depth look at 10 technologies changing the future of passive and control components Rohde & Schwarz. Introduction to the new R&S FSW signal and spectrum analyzer that features a wide analysis bandwidth and straightforward, intuitive operation Valpey Fisher Corp. Thomas Arthur, Director of Marketing, Microwave Products Group at Valpey Fisher, provides insight into RF integrated passive d...

Stephen Beeby, Graham Ensell, Michael Kraft, Neil White. MEMS Mechanical Sensors

  • формат pdf
  • размер 13.94 МБ
  • добавлен 26 марта 2010 г.
Artech House, 2004, 281 p. Here's the book to keep handy when you have to overcome obstacles in design, simulation, fabrication and application of MEMS sensors. This practical guide to design tools and packaging helps you create the sensors you need for the full range of mechanical microsensor applications. Critical physical sensing techniques covered include piezoresistive, piezoelectric, capacative, optical, resonant, actuation, thermal, and m...

Zhou Y. Microjoining and Nanojoining

  • формат pdf
  • размер 37.05 МБ
  • добавлен 19 сентября 2011 г.
Woodhead Publishing Limited, 2008, 810 pages Many recent advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part 1 reviews the basics of microjoining, includin...