Lallart M. Ferroelectrics: Applications

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Giant k

Relaxor Single-Crystal Plate and Their Applications

shows the comparison between frequency responses of impedance in (a) the PZNT91/09

single-crystal plate and (b) the conventional PZT ceramic plate. The k

’s were 86.2%

(PZNT91/09: sample No. 2-3 in Table 4) and 37.3% (PZT), respectively.

5.1.2 Bending mode prpperties

The PZNT91/09 single-crystal plate (13

x4.0

x0.36

mm) with giant k

of 86.2% (No. 2-3 in

Table 4) was stuck on a center shim plate (15

x0.20

mm) composed of 42 nickel alloy to

prepare a piezoelectric unimorph. The same dimensions of the PZT ceramic plate (k

=37%,

=-330 pC/N) was also used to realized a unimorph. Figure 29 shows the comparison

between frequency responses of impedance in (a) the PZNT91/09 single-crystal unimorph

and (b) the conventional PZT ceramic unimorph. The k

=64.7% on bending mode in the

PZNT91/09 single-crystal plate was three times larger than the k

=20.6% in the PZT ceramic

plate. Therefore, it was confirmed that the giant k

and d

constant could be useful to

realize the piezoelectric unimorphs with high efficiency as well as the plate (13

x4.0

x0.36

mm) resonators with giant k

and d

constant.

Fig. 29. Frequency responses of impedance on k

mode in (a) PZNT91/09 single-crystal

unimorph and (b) PZT ceramic unimorph.

A piezoelectric bimorph was fabricated by sticking the PZNT91/09 single-crystal plate with

giant k

of 85.6% (No. 3-1 in Table 4) on the PNZT91/09 single-crystal unimorph with the k

of 64.7% as previously mentioned. A PZT ceramic bimorph was also prepared. Figure 30

shows the comparison between frequency responses of impedance in (a) the PZNT91/09

Ferroelectrics - Applications

single-crystal bimorph and (b) the conventional PZT ceramic bimorph. The k

=69.8% on

bending mode in the PZNT91/09 single-crystal plate was twice larger than k

=31.2% in the

PZT ceramic plate. Therefore, it was confirmed that highly efficiency piezoelectric devices

could be realized to utilize PZNT91/09 single-crystal plates with giant k

and d

constant

in the cases of the piezoelectric bimorphs as well as the piezoelectric unimorphs.

Fig. 30. Frequency responses of impedance on k

mode in (a) PZNT91/09 single-crystal

bimorph and (b) PZT ceramic bimorph.

5.1.3 Displacement properties

The displacement was evaluated regarding the PZNT91/09 single-crystal unimorphs (the

center shim plate thickness of 0.20 mm)/ bimorphs (the center shim plate thickness of 0.10

mm) and the PZT ceramic unimorphs (the center shim plate thicknesses of 0.10 mm and 0.20

mm)/ bimorphs (the center shim plate thickness of 0.10 mm). In the case of a series-type

bimorph in Fig. 31, the total displacement (

u =a+b) was estimated by the following

equation;

ud V

⎛⎞

⎜⎟

=⋅+×

⎜⎟

⎝⎠

(1)

where

l : effective length (9 mm), t : thickness of devices (0.36+0.2 mm for single-crystal and

ceramic unimorphs, 0.36+0.1 mm for ceramic unimorph, and 0.36x2+0.1 mm for single-

Giant k

Relaxor Single-Crystal Plate and Their Applications

crystal and ceramic bimorphs),

t : thickness of shim plate (0.1 mm and 0.2 mm), V : applied

voltage and

: non-linearity coefficient, respectively.

-V

Fig. 31. Series type bimorphs and total displacement.

The relationships between the applied voltage and the displacement were shown in Fig. 32

for the different shim thickness in the PZNT single-crystal unimorph and the PZT ceramic

unimorph. The d

constants of the stuck piezoelectric plates calculated from the frequency

responses of the impedance were -2020 pC/N in the PZNT91/09 single crystal and -330

pC/N in the PZT ceramics, respectively. The displacement of the PZNT91/09 single-crystal

unimorph was twice larger than the one of the PZT ceramic unmorph. The decrease in

thickness of the shim plate from 0.20 mm to 0.10 mm increased the displacement in the

range of over 100 V. The

calculated from (1) was 0.4~0.5 in the PZNT91/09 single-crystal

unimorph. Otherwise, the

was 1.0 (≦100 V) and 1.6 at 180 V in the PZT ceramic

unimorph. Furthermore, the

was independent of the shim plate thickness in the PZT

ceramic unimorphs.

Fig. 32. Applied voltage dependence of displacement in PZNT91/09 single-crystal

unimorph (□: shim thickness of 0.20 mm) and PZT ceramic unimorph (■: shim thicknesses

of 0.20 mm and ◆: 0.10 mm).

Ferroelectrics - Applications

Figure 33 shows the applied voltage dependence of the displacement in the PZNT91/09

single-crystal bimorph and the PZT ceramic bimorph. The average d

constants of the two

stuck PZNT91/09 single-crystal plates and the two stuck PZT ceramic plates also showed in

this figure. Although the d

constant of the PZNT91/09 single crystals is 4~7 times larger

than the d

of the PZT ceramics, the displacement of the PZNT91/09 single-crystal bimorph

became almost twice larger than the one of the PZT ceramic bimorph. The reason the

displacement becomes twice, not more, was due to that the

in the PZNT91/09 single-

crystal bimorph was a half of the

in the PZT ceramic bimorph.

Fig. 33. Applied voltage dependence of displacement in PZNT91/09 single-crystal

bimorph (○: shim thickness of 0.10 mm) and PZT ceramic bimorph (●: shim thickness of

0.10 mm).

The origin of the decrease in

of the PZNT91/09 single-crystal bimorph was thought the

mechanical softness of PZNT91/09 single-crystal plates with giant k

and d

constant.

Namely, the Young’s modulus of PZNT single crystals (0.89x10

N/m) is one order smaller

than the one of PZT ceramics (6~8x10

N/mm). In addition to the above mentioned, the

values of

in bimorphs were approximately twice larger than the ones of unimorphs. This

phenomenon was thought that the

depends on the number of the piezoelectric plate; one

plate in unimorph and two plates in bimorph, respectively.

In conclusion of this part, the process combination of poling and annealing to obtain giant

and d

constant was clarified to fabricate PZNT91/09 single-crystal unimorphs and

bimorphs. The coupling factors on bending mode (k

) in PZNT91/09 single crystal

unimorphs and bimorphs were 2~3 times larger than the k

’s in PZT ceramic unimorphs

and bimorphs. The displacement of PZNT91/09 single-crystal unimorphs and bimorphs

was almost twice larger than the one of PZT ceramic devices. The advantage of PZNT91/09

single-crystal plates with giant k

and d

constant was confirmed through the development

of piezoelectric devices such as unimorphs and bimorphs.

Giant k

Relaxor Single-Crystal Plate and Their Applications

6. Conclusion

We found the giant electromechanical coupling factor of k

mode to be over 80% and the

piezoelectric d

constant to be nearly -2000 pC/N

in ferroelectric relaxor single-crystal

plates. The discovery of the giant k

and the d

constant became breakthroughs in

applications to high-performance sensors and actuators utilizing k

mode.

7. Acknowledgments

This work was partially supported by the Grant-in-Aid for Scientific Research C (Nos.

12650327, 17560294) from the Ministry of Education, Culture, Sports, Science and

Technology, and the Foundation from the Regional Science Promotion (RSP) program 2004

of the Japan Science and Technology Agency, and the Research Foundation Grant 2003,

2006, 2007, 2008 jointly sponsored by Academia and Industry of Fukuroi City. The author

would like to thank the Research Laboratory of JFE Mineral Co., Ltd. for supplying the

PZNT and PMNT single-crystal plates.

8. References

Koto, R. et al. (2006). Chemical Composition Dependence of Giant Piezoelectricity on k

Mode in Pb(Mg

1/3

2/3

–PbTiO

Single Crystals, Jpn. J. Appl. Phys., Vol.45, pp.

7418-7421.

Koto, R. & Ogawa, T. (2007). Frequency Response Analysis by Finite Element Method in

Relaxor Single-Crystal Plates with Giant k

, Jpn. J. Appl. Phys., Vol.46, pp. 7058-

7062.

Kuwata, J. et al. (1982). Dielectric and Piezoelectric Properties of 0.91Pb(Zn

1/2

2/3

0.09PbTiO

Single Crystals, Jpn. J. Appl. Phys., Vol.21, p. 1298-1302.

Matsushita, M. et al. (2001).

Abstr. Am. Ceram. Soc., 103rd Annual Meet., p. 247.

Ogawa, T. & Nakamura, K. (1999). Effect of Domain Switching and Rotation on Dielectric

and Piezoelectric Properties in Lead Zirconate Titanate Ceramics,

Jpn. J. Appl. Phys.,

Vol.38, pp. 5465-5469.

Ogawa, T. et al. (2002). Giant Electromechanical Coupling Factor of k

Mode and

Piezoelectric d

Constant in Pb[(Zn

1/3

2/3

)

0.91

0.09

Piezoelectric Single Crystal,

Jpn. J. Appl. Phys., Vol.41, pp. L55-L57.

Ogawa, T. & Numamoto, Y. (2002). Origin of Giant Electromechanical Coupling Factor of k

Mode and Piezoelectric d

Constant in Pb[(Zn

1/3

2/3

)

0.91

0.09

Single Crystal,

Jpn. J. Appl. Phys., Vol.41, pp. 7108-7112.

Ogawa, T. et al. (2005). Giant Piezoelectricity on k

Mode in Pb(Mg

1/3

2/3

–PbTiO

Single Crystal,

Jpn. J. Appl. Phys., Vol.44, pp. 7028-7031.

Ogawa, T. (2005). Piezoelectric Bimorph with Giant Electromechanical Coupling

Factor of Bending Mode Nearly 70% Fabricated by Low Symmetry

Mono-Domain Pb[(Zn

1/3

2/3

)

0.91

0.09

Single Crystal, Ferroelectrics, Vol.320, pp.

115-123.

Ferroelectrics - Applications

Ogawa, T. (2008). Giant Transverse-Mode Electromechanical Coupling Factor and

Piezoelectric Strain in Relaxor Single-Crystal Plates Evaluated Using P-E Hysteresis

Loop,

Jpn. J. Appl. Phys., Vol.47, pp. 7655-7658.

Yin, J. et al. (1999).

IEEE Proc. Med. Imag., Vol.3664, p. 239.

MEMS Based on Thin Ferroelectric Layers

Igor L. Baginsky and Edward G. Kostsov

Institute of Automation and Electrometry,

Russian Academy of Sciences,

Russia

1. Introduction

Micro-Electro-Mechanical Systems (MEMS) are devices that display the most intense

development in modern microelectronics (Kostsov, 2009).

The main challenge of microelectromechanics is the design of unique micromechanical

structures for various purposes. This research direction is based on achievements of advanced

microelectronic technologies and inherits the basic advantages of electronic microchips: high

reliability and reproducilbility of characteristics, low cost, and large scales of applications

(Esashi & Ono, 2005). The essence of micromechanics implies that advanced microelectronic

technologies, for instance, deep etching of silicon (or silicon-on-insulator (SOI)) make it

possible to create integrated circuits (ICs) simultaneously with micromechanical structures

with unique parameters (determined by their microscopic or nanoscopic sizes, with the

transported mass being 10

-4

to 10

-18

g) controlled by electronic circuits.

The most important feature of MEMS is the precision fabrication of moving elements of

mechanical structures (earlier inaccessible in mechanics) and their uniﬁcation in one

technological cycle with controlling and processing electronic elements created on the basis

of CMOS technology.

MEMS applications include the following areas (Kostsov, 2009):

- microoptoelectromechanics (displays, adaptive optics, optical microswitches, fast-

response scanners for cornea inspection, diﬀraction gratings with an electrically tunable

step, controlled two- and three-dimensional arrays of micromirrors, etc.);

- high frequency (HF) devices (HF switches, tunable ﬁlters and antennas, phased antenna

array, etc.);

- displacement meters (gyroscopes, highly sensitive two- and three-axial accelerometers

with high resolution, which oﬀer principally new possibilities for a large class of

electronic devices);

- sensors of vibrations, pressures, velocities, and mechanical stresses; microphones (there

are millions of them in cellular phones). Back in 2004, Intel started to deliver RF front-

end assemblies fabricated by the MEMS technology for cellular phones. They integrate

approximately 40 passive elements, which allows the producer to save up to two thirds

of space in the phone casing;

- wide range of devices for working with microvolumes of liquids and for applications in

biology, biochips, biosensors, chemical testing, creation of a new class of chemical

sensors, etc.;

- microactuators and nanopositioners; microgenerators of energy.

Ferroelectrics - Applications

Many experts think that the telecommunications market is one of the promising areas of

MEMS implementation, including the technologies related to optical switches for ﬁber-

optical telecommunications systems.

It becomes obvious that none of the fields of modern electronic engineering will avoid the

touch of the new industrial revolution.

The basic component of most micromechanical devices is the energy converter, namely,

micromotor (or microactuator). Therefore, the main attention in this work is paid to the

analysis of the operation of new micromotor proposed by us, the examples of the

micromotor application in MEMS devices are presented at the end of the chapter.

There are electromagnetic, electrothermal, piezoelectric and electrostatic effects among the

variety of physical principles basic for these converters.

Presently, there are two common kinds of the motors (the devices that convert electrical

energy into the mechanical motion): induction motors (IM) and electrostatic motor (EM).

Classic electrostatic motors are not widely used mainly because it is necessary to use high

operating voltage to achieve the specific energy output comparable with IM motors. At the

same time, the specific energy output of the IM decreases as their power becomes small, and

this decrease starting from power of 10-100 mW makes induction micromotors ineffective.

The advantages of the capacitance (EM) machines over IM machines in the low power

domain can be attributed to the main difference between the electric and magnetic

phenomena: the existence of electric monopoles and the absence of magnetic ones. To create

an electric field in the operating gap of the capacitance devices it is enough to have a small

amount of the conductive matter. At the same time, to create magnetic field in the operating

gap of the induction machines it is necessary to have large amounts of ferromagnetic matter

in the form of large magnetic conductor that is used to create opposite magnetic charges at

the ends of the gap. This magnetic conductor is the reason for the low energy output of the

small energy capacity induction machines.

The parameters of the capacitance electromechanical devices such as driving force, power,

reaction time with respect to voltage pulse can be improved by the increase in the field

strength in the gaps, as they are proportional to the energy density of the field εε

/2,

where ε and ε

are the dielectric permeabilities of the medium and the vacuum.

Use of the micromachining for the manufacturing of the electrostatic micromotors allows

one to reach significantly smaller gaps (on the order of several micrometers), and to get

higher values of electric field strength and energy density (Harness& Syms, 2000; Wallrabe

et al.,1994; Zappe et al., 1997; Kim & Chun, 2001).

The estimates of specific energy output based on the energy density of electric and magnetic

fields can be used to determine the gap width necessary for the electric field energy density

to be comparable to or higher than magnetic field energy density (~4-5·10

J/m

with 1 T

induction and very high quality of magnetic material). For 20-60V voltage, the gap is 2 µm.

Such a gap that is used in modern electrostatic micromotors results in the higher value of

the electric energy stored in the sample, as compared to the classical electrostatic motors,

and, consequently, in the better motor efficiency.

With the help of silicon deep etching technology the gaps of about 2 μm can be created, so

the specific electric capacitance C

and specific energy output A

of the elemental actuator

can be as high as 4 pF/mm

and 10

-8

J/mm

respectively, and the driving force F can achieve

the value of 10

-6

- 10

-5

The processibillity in fabrication of electrostatic motors, the simple design and no need to

use the magnetic core are the reasons for the dominant use of the electrostatic

microactuators in MEMS.

MEMS Based on Thin Ferroelectric Layers

The operation principle of these microactuators is as follows: the moving electrode is pulled

in the interelectrode gap with the pulling force equal to (V

∂С/∂х)/2 (V is applied voltage, C

– total capacitance of the structure). The drawbacks of these microactuators are the small

values of the main parameters C

, A

, F and the small range of moving element (moving

platform, MP) motion – on the order of 5 – 50 μm. To increase the power of the device it is

necessary to use many microactuators in parallel and, consequently, use a significant part of

the integrated circuit surface. The forces developed by these micromotors are in the range of

1 – 10 μN. This value determines the field of the micromotor applications.

A certain increase of С

, not more than by one order of magnitude, can be achieved by

filling the interelectrode gap by dielectric. The techniques of such energy conversion were

proposed in papers (Dyatlov, et.al., 1991; Dyatlov, et.al., 1996; Sato & Shikida, 1992;

Akiyama & Fujita, 1995).

On the other hand the thin-film metal-ferroelectric-metal structures have high enough

electrical power capacity, which can exceed the corresponding capacity of air gap by

thousand times due to high values of ε at higher breakdown strength. To convert even a part

of this energy into mechanical one we have use the effect of reversible electrostatic attraction

of thin metal films to the surface of ferroelectrics under action of electric field, so called

„electrostatic glue“.

2. “Electrostatic glue“

The object of study was thin-film structures of a new type synthesized on the surfaces of

silicon or sapphire substrates and composed of a ferroelectric film with a high permittivity ε

and thickness d and an elastic mobile thin electrode with an air nanogap of thickness d

between (fig. 1).

The ferroelectric component was a strontium barium—niobate (SBN) film doped with

lanthanum (Ba

0.5

+ 1% La) and with a permittivity of 3000—5000. The film was

synthesized on an ITO (In

+ 6% SnO

) electrode surface. The thicknesses of the ITO and

SBN films were 0.1—0.5 and 0.3—3 μm, respectively. The preparation technique of the films

and their main electrical characteristics were described in (Kostsov, 2005).

During the electrostatic attraction of the petal to the ferroelectric surface the total current

consisting of the conductive current and the capacitance current arises in the electric circuit.

Our technique allows us to separate these components during in real time.

Fig. 1. Schematic diagram illustrating the electrostatic pressing of a metal film (1) to the

surface of ferroelectric film (2), deposited on a substrate (4) with a barrier electrode (3)

The voltage pulse applied to the structure was modulated by sine voltage with the

frequency equal to 1 MHz and the amplitude equal to 1 – 2% of the total pulse amplitude V.

The response to this voltage pulse allows one to measure alternating conduction (in-phase

signal) and capacitance (signal shifted by 90º) current, and then one can calculate the

transient values of conductivity and capacitance C(t).

Ferroelectrics - Applications

Study of C(t) behavior during the electrostatic pressing of the metal and the ferroelectric

surfaces performed on the prototype consisting of the large petal (l=10 mm in length and

b=1 mm in width) freely lying on the surface of the ferroelectric film (see fig.2) shows that as

V grows, the process duration abruptly drops. The C(t) values initially grows, and then

comes to the saturated value that is determined by the width of the air gap between the

metal and the ferroelectric and the parameters of the BSN film. As V grows further,

saturated value of C(t) can fall because the capacitance of ferroelectric layer becomes smaller

due to the polarization screening in the ferroelectric. To reduce this effect of polarization

charge accumulation it is necessary to apply shorter pulses, use shorter petals and apply

bipolar voltage pulses (Baginsky & Kostsov, 2004). With l equal to 1-3 mm pulse duration t

should be between 50 –500 μs.

Fig. 2. Time behaviour of the capacitance of the free lying petal – BSN film (d=2.4 μm) –

electrode structure when a voltage pulse with duration of t

=5 ms and amplitude V= 1 – 30,

2 – 40, 3 – 50 V is applied.

Due to the high ε value, the electric field in the structure under a voltage V is such that the

potential drops mainly on the air gap between the mobile electrode and ferroelectric film;

i.e., the field is mainly concentrated in the gap, and the specific capacitance of the structure

is several times less than the specific capacitance C

of the metal-ferroelectric-metal

(MFM) structure with the applied electrodes. At sufficiently high values of ε/d the value of

approaches to the gap capacitance C

, and the experimental studies show that k

can be

about 0.05 – 0.5, see fig. 3a. The field redistribution between the ferroelectric and air gap

may occur only at high ε values (specifically, when ε/d > 10

—1

(Kostsov, 2008)). Analysis

of the field distribution in the air gap for different ε/d values shows that, with a decrease in

, the pressing force F

(dC

/dz) for the mobile electrode to the ferroelectric surface

nonlinearly increases (fig. 3b). The force significantly increases beginning from a distance of

100 nm or less between the surfaces, and at ε/d > 10

—1

one can obtain a pressure of more

than 10

N/cm

in the nanogap. Note that for the linear dielectrics (ε/d < 10

—1

) the

voltage drop on the nanogap is insignificant. Although the voltage applied to the nanogap is

fairly high (up to 100 V or more), it does not cause electric breakdown, because (i) the

Paschen law is invalid for such narrow air gaps and (ii) in this structure the ferroelectric film

resistance more than 10 MOhm/mm

is connected in series with the gap. The breakdown

field strength of the ferroelectric film exceeds 100 V/μm, and a low voltage drop directly on

the ferroelectric film excludes its breakdown.

The air nanogap width d

determined by measuring the total capacitance of the structure is

falling with an increase in the voltage applied. For a specific sample, the minimum d

value