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Radiation Environments and Damage in Silicon Semiconductors 347
recoil energies much larger than the displacement threshold energy, E
d
, cascading
displacements will occur in a closely spaced group of defects (the so-called cluster
or cluster of defects, e.g., see Sect. 4.2.2) within a small spatial region (or even a
few small spatial regions). Figure 4.14 shows an example of simulated cascading-
displacements by a silicon recoil in bulk silicon after the interaction with an incoming
neutron of 50 keV kinetic energy (from [van Lint, Leadon and Colweel (1972)]; see
also Chapter 2 of [van Lint, Flanahan, Leadon, Naber and Rogers (1980)]): a
few energetic collisions produce other energetic recoils interspaced with many more
low-energy transfers. Thus, cascading displacements result in (terminal) clusters of
defects.
The thermal energy allows some defects to migrate through the crystal and,
eventually, be annihilated by the recombination of the V –I pairs or create stable
defects in association with other impurities or defects already present (or induced
by radiation). The presence of defects and clusters of defects produces changes in
the properties of the semiconductor.
In radiation-induced defects, E
d
is several times greater than the energy re-
quired for adiabatic displacements of atoms from lattice to interstitial positions. E
d
depends on the recoil direction and, for silicon, is about (13–33) eV (e.g., see Chap-
ter 1 in [Vavilov and Ukhin (1977)], [Chilingarov, Lipka, Meyer and Sloan (2000)]
and references therein). In most of calculations, in particular for incoming neutrons
(see Sect. 4.2.1.5), an isotropic value of 25 eV is assumed (e.g., see page 24 of [Di-
enes and Vineyard (1957)], Section 2.4.2 in [van Lint, Flanahan, Leadon, Naber and
Rogers (1980)] and references therein, see also Section V of [Nichols and van Lint
(1966)]).
There has b een substantial progress in understanding the degradation generated
in integrated bipolar transistors
§
and silicon detectors
¶
by fast neutrons, i.e., typ-
ically above 10 keV, which induce displacement damages. Neutrons with sufficient
large energies, like for instance fast neutrons, can transfer enough kinetic energy to
the recoil atom to generate clusters of displacements with a cascading effect.
Most predictions of the neutron energy dependence in semiconductor (i.e. sili-
con) devices have been based on the amount of non-ionizing energy deposited. In
literature (see for instance [Namenson, Wolicki and Messenger (1982); Ougouag,
Williams, Danjaji, Yang and Meason (1990); Vasilescu (1997)]), the damage effect
due to initial and cascading-displacements induced by neutrons (Sect. 4.2.1.2) is
§
The reader can see, e.g., [Messenger (1966, 1972, 1992); Colder et al. (2001); Claeys and Simoen
(2002); Holmes-Siedle and Adams (2002); Co degoni et al. (2004b); Consolandi, D’Angelo, Fallica,
Mangoni, Modica, Pensotti and Rancoita (2006)] and references therein.
¶
One can see, e.g., [Borgeaud, McEwen, Rancoita and Seidman (1983); SICAPO Collab. (1986,
1994b,c, 1995c); Croitoru, Dahan, Rancoita, Rattaggi, Rossi and Seidman (1997); Croitoru, Ran-
coita, Rattaggi, Rossi and Seidman (1997); Dezillie, Bates, Glaser, Lemeilleur and Leroy (1997);
Borchi, Bruzzi, Leroy, Pirollo and Sciortino (1998); Croitoru, David, Rancoita, Rattaggi and Sei-
dman (1998a); Croitoru, Gubbini, Rancoita, Rattaggi and Seidman (1999a); Leroy, Roy, Casse,
Glaser, Grigoriev and Lemeilleur (1999a); Mangiagalli, Levalois, Marie, Rancoita and Rattaggi
(1999); Golan et al. (2001); Rose Collab. (2001)] and references therein.