Martienssen W., Warlimont H. (Eds.). Handbook of Condensed Matter and Materials Data

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342 Part 3 Classes of Materials

Diffusion

Data for self-diffusion of Ag in Ag alloys and diffusion

of tracer impurity elements are shown in Tables 3.1-153–

3.1-158 andFigs. 3.1-210–3.1-212. Diffusionof H andO

is of importance for annealing treatments and dispersion

hardening [1.217,220, 226,235].

Table 3.1-153 Self-diffusion in binary homogeneous

−

Au alloys [1.217, p. 150]

Au (at.%) T (K) D

(10

/s) Q (kJ/mol)

−

Au (

110m

Ag diffusion)

8 927–1218 0.52 187.5

17 908–1225 0.32 184.4

83 923–1284 0.09 171.7

94 936–1234 0.072 168.5

−

Au (

198

Au diffusion)

8 991–1213 0.82 202.2

17 991–1220 0.48 198.0

83 985–1274 0.12 180.2

94 991–1283 0.09 176.1

Element D

/s) Q (kJ/mol) T (K)

Lattice Ag 0.278 181.7 1038–1218

Ag(s)

0.67 190.1 913–1221

Au 0.107 176.9 623–733

Au(s)

0.027 165 603–866

Surface Ag 1×10

264 873–1173 (H

)

Ag 3×10

−5

49 580–730 (Vac.)

Au(110) 1×10

227 1138–1329 (H

)

Au 8×10

272 1200–1300 (Vac.)

Grain- Ag 7.24 × 10

−5

190.4 ∼790–680

boundary

Au 9.10 × 10

−6

174.6 625–521

(s) = single crystal

Table 3.1-154 Self-

diffusion in pure

Ag and Au [fre-

quency factor

(10

−4

/s)],

activation energy Q

(kJ/mol) [1.217,

p. 149]

Table 3.1-155 Diffusion of Ag in Cu and Cu in Ag [1.226, p. 365f.]

Ag in Cu

T (

◦

C) 485 574 625 731 794

4.9×10

−14

8.2×10

−13

2.91× 10

−12

7.7×10

−11

1.65× 10

−10

±0.1 ±0.6 ±0.08

D = D

exp(−E

/RT ) with D

= 0.61 cm

/s, E

= 46.5 kcal/g-at.

Cu in Ag

T (

◦

C) 498 597 760 800 895

2.87× 10

−13

5.08× 10

−12

3.55× 10

−10

5.9×10

−10

9.4×10

−10

±0.45 ±0.54

= 1.23 cm

/s, E

= (46.1 ±0.9) kcal/g-at.

D (m

–1

)

0.85

–13

4×10

–15

0.88 0.91 0.94 0.97

(10

–3

–1

)

1.03

–14

1.00

1/T

6.56 at. % Cu

4.16 at. % Cu

1.75 at. % Cu

Ag-Cu

Fig. 3.1-210 Self-diffusion of Ag(110w) in Ag

−

(1.75–6.56 at.% Cu) alloys [1.238, p. 189]

Part 3 1.10

Metals 1.10 Noble Metals and Noble Metal Alloys 343

Table 3.1-156 Diffusion of impurities in Ag, Au, Pt and Pd [1.217, p. 151]

Tracer D

(10

−4

/s) Q (kJ/mol) T(K) Tracer D

(10

−4

/s) Q (kJ/mol) T(K)

Matrix: Silver (Ag) Matrix: Gold (Au)

Cu 1.23 193.0 990–1218 Pd 0.076 195.1 973–1273

0.029 164.1 699–897 Pt 0.095 201.4 973–1273

Au 0.262 190.5 923–1223 Ag 0.072 168.3 943–1281

0.41 194.3 929–1178 0.08 169.1 1046–1312

0.85 202.1 991–1198 0.086 169.3 1004–1323

0.62 199.0 Hg 0.116 156.5 877–1300

Pd 9.57 237.6 1009–1212 Matrix: Platin (Pt)

Pt 6.0 238.2 923–1223 Ag 0.13 258.1 1473–1873

1.9 235.7 1094–1232 Au 0.13 252.0 850–1265

Ru 180 275.5 1066–1219 Matrix: Palladium (Pd)

Fe 0.18 260 1373–1523

Table 3.1-157 Grain boundary tracer diffusion in pure

Ag [1.217, p. 150]

Matrix Tracer D

Q T

metal

/s) (kJ/mol) (K)

Ag Cd 5.04 × 10

176.6 772–557

In 5.50 × 10

174.8 764–469

Sb 2.34× 10

163.5 771–471

Sn 4.72× 10

170.9 776–527

Te 2.10×10

154.7 970–650

Table 3.1-158 Diffusion of hydrogen and oxygen in Ag,

Pd, Pt, and Au [1.217, p. 151]

Matrix Gas D

(10

−4

/s) Q (kJ/mol) T(K)

Ag H 8.55 ×10

−3

30.11 947–1123

Ag O 3.66 ×10

−3

46.1 680–1140

Pd H 2.9×10

−3

22.19 473–1548

D 1.7×10

−3

19.88 218–233

T 7.2×10

−3

23.8 273–323

Pt H 6×10

−3

24.70 600–900

Au H 5.6×10

−4

23.61 773–1213

1.6

D (10

–13

–1

)

02040

Au (at.%)

10080

1.2

0.8

0.4

Ag-Au

(10

–3

–1

)

4 × 10

–12

0.85 1.30

1/T

2 × 10

–19

0.80

1200 (K)

T (K)

0.90 0.95 1.00 1.05 1.10 1.15 1.20

–1

)

–12

–13

–14

–15

–16

–17

–18

1100 1000 900 800

1.25

= 1235 K

Matrix: Ag

Ge Sb Al

Fig. 3.1-211 Diffusion of impurities in Ag [1.238, p. 244]

Fig. 3.1-212 Self-diffusion of Ag(110w) (brown circles)

and Au(198) (gray circles)inAg

−

Au (8–94 at.%) Ag

−

alloys [1.238, p. 190]

Part 3 1.10

344 Part 3 Classes of Materials

Chemical Properties

Silver has the reduction potential of E

=+0.8V for

Ag/Ag

. It is resistant against dry oxygen, air, non-

oxidizing acids, organic acids, and alkali. Water and

water vapor do not attack Ag up to 600

◦

C. Ag is dis-

solved in alkaline cyanidic solutions in the presence

of oxidizing agents, air, and oxygen. H

S attacks Ag

readily at room temperature, forming black Ag

S layers

(tarnish) [1.217].

Metallic Ag and Ag

−

Au alloys are heterogeneous

catalysts for oxidation processes, e.g., in the produc-

tion of ethylene oxide and formaldehyde applied as

grids or as powder preparations on Al

or carbon

substrates [1.217].

Ag-Based Materials

Binary alloys (Tables 3.1-159–3.1-161) [1.218]: Ag

−

alloys are grain-stabilized materials usually containing

0.15 wt% Ni. Ag

−

Cu alloys have manifold applications

in jewelry, silverware, brazes, and solders. Jewelry, sil-

Table 3.1-159 Noble metal containing soft solders [1.217]

Alloy Melting Density Tensile Elongation Eleasticity Thermal Electrical Thermal

(wt%)

range (

◦

C) (g/cm

) strength (%) module expansion conductivity conductivity

(N/mm

) (N/mm

) (10

−6

−1

) (m/ mm

) (W/mK)

AuSn20 280 14.57 275 < 1 59 200 16 < 5 57.3

AuGe12 356 14.70 150–200 < 1 69 300 13.4 7 44.4

AuSi2 363–740 14.50 500–600

0.5–3

12.6 33 50

SnAg25Sb10 228–395 7.86 80–120 1–4 23 000 19 6.5 55

SnAg3.5 221 7.38 25–35 20–30 41 100 27.9 7.5 57

PbSn5Ag2.5 280 11.70 25–35 20–30 21 300 29 < 5 44

PbIn5Ag2.5 307 11.60 35–40 28–34 19 900 29 < 5 42

Hard rollded condition

Table 3.1-160 Noble-metal-containing brazing alloys [1.217, p. 560]

Alloy Melting Density Tensile Elongation E-Modul. Thermal Electrical Thermal ISO

(wt%)

range (

◦

C) (g/cm

) strength (%) (N/mm

) expansn. condct. condct. Type 3677

(N/mm

) (10

−6

−1

) (m/ mm

) (W/mK)

AgCu28 779 10.00 250–350 20–28 100 000 19.8 10 B Ag72 Cu780

AgCu27In13 605–710 9.70 400–500 20–30 85 000 17.8 46.1 352 B Ag60CuIn 695-710

AgCu26.6Pd5 807–810 10.10 370–410 12–20 120 000 22 26 215 B Ag68CuPd 807-810

AgCu31.5Pd10 824–852 10.10 500–540 2–5 140 000 17.5 19 150 B Ag58CuPd 824-852

AgCu20Pd15 850–900 10.40 510–550 5–9 140 000 22 15 100 B Ag65CuPd 850-900

AgCu21Pd25 910–950 10.50 540–580 13–21 140 000 17.5 8 80 B Ag54PdCu 901-950

AgPd5 970–1010 10.50 180–220 26–34 40 000 22 25 220 B Ag95Pd 970-1010

CuPd18 1080–1090 9.40 380–420 31–39 135 000 18.9 9.1 100 B Cu82Pd 1080-1090

AgCu28Pd20 879–898 10.30 580–620 6–10 100 000 18.6 9.5 95 B Ag52CuPd 879-898

AuNi18 950 15.96 550–650 8 14.6 5.9 B Au82Ni 950

Table 3.1-161 Physical properties of noble-metal-contain-

ing vacuum braze alloys [1.217, p. 560]

Composition Solidus Liquidus

(

◦

C) (

◦

−

Cu Ag40Cu19Zn21Cd20 595 630

Ag60Cu27In13 605 710

Ag44Cu30Zn26 675 735

Ag72Cu28 779 E

−

Mn Ag85Mn15 950 950

−

Pd Ag68.4Pd5Cu26.6 807 810

Ag54Pd25Cu21 901 950

Ag75Pd20Mn5 100 1120

−

Cu Pd18Cu72 1080 1090

−

Ni Pd60Ni40 1237 1237

−

Cu Au80Cu20 890 890

Au33Cu65 990 1010

−

Ni Au82Ni18 950 950

E = Eutectic composition

Part 3 1.10

Metals 1.10 Noble Metals and Noble Metal Alloys 345

Table 3.1-162 Typical powder grades of Ag, Pd, and Ag

−

Pd preparations for capacitors

Metal Manufacturing Grain Grain size Tap density Speciﬁc surface

method shape (µm) (g/cm

) (m

/g)

Ag Chemical reduction Microcrystalline 0.5–2.0 0.8–5.0 0.1–2.0

Electrolytic deposition Dendritic 1–200 4.5–4 0.1–0.5

↓

Ball milling Flakes 2–40 2.5–5 0.2–1.8

Pd Chemical reduction Crystalline < 20 0.8 2.5

spheres < 1.2 4.0 2.3

−

Pd30 Coprecipitation Spheres < 1.2 3.3 2.2

↓

Flakes < 9 3.4 3.3

BET in N

adsorption

ver ware alloys, and coins usually contain between

7.5 wt% Cu (“sterling silver”) and 20 wt% Cu. The

material Ag–28 wt% Cu is the most common silver

brazing alloy. Alloys of Ag

−

Mn are special sol-

ders for hard metal and refractory metals (Mo, W).

The alloy Ag–1 wt% Pt is applied in thick ﬁlm lay-

ers for conductor paths in passive electronic devices.

−

Pd powderpreparations containing 10 to 30 wt% Pd

form the conductor layers in multilayer capacitors

(Table 3.1-162) [1.217].

Ternary and Higher Alloys

Alloys of the systems Ag

−

Sn, Ag

−

Zn,

and Ag

−

P are used as solders and brazes.

−

P solder alloys can be applied without ﬂux.

Ti-containing solder alloys (active solders) allow di-

Table 3.1-163 Hardness and electrical conductivity of Ag

−

C (contact) alloys [1.226, p. 436]

Alloy content wt% C 3 2 2.5 2.5 2.5

Alloy content wt% Ni0.5 0.5 0.5 1 5 10

HV (kg/mm

)

40.5

43 53 50 53 56–57

Electrical conductivity 63.7 74.8 69.8 67.3 64.5

in % of standard Cu

rect bonding to ceramics (Table 3.1-162) [1.239].

Alloys of the systems Ag

−

Cu, Ag

−

Ni, and

−

Pd are applied in jewelry and dentistry (Ta-

bles 3.1-186, 3.1-187).

The oxide AgO forms the cathode of AgO/Zn button

type batteries with a cell voltage of 1.55 V and with en-

ergy densities in the range of 80–250 W h/dm

[1.218,

240–242].

Composite materials with SnO

, CdO, carbon,

Ni, and refractory carbides as dispersoids are base

materials of electrical (Tables 3.1-163, 3.1-164, and

Fig. 3.1-213) [1.226, 231, 243]. Extruded powder com-

posites show preferred alignment of the dispersoid

particles along the rod axes. Silver–nickel ﬁber com-

posites are magnetic. Their coercivity increases with

decreasing diameter of the Ni ﬁbers [1.244].

Part 3 1.10

346 Part 3 Classes of Materials

Table 3.1-164 Silver bearing composite contact mater-

ials [1.243, p. 156]

Type Composition Hardness Electrical

(at.%) HV conductivity

(m/ mm

)

Alloys AgNi(0.15) 100 58

AgCu(3) 120 52

↓

AgCu(20) 150 49

Composites with:

Metals Ag

−

Ni(10) 90 54

↓

−

Ni(40) 115 37

Oxides Ag

−

CdO(10) 80 48

↓

−

CdO(15) 115 45.5

−

ZnO(88) 95 49

−

SnO

(8) 92 51

−

SnO

(12) 100 42

Carbon Ag

−

C(2) 40 48

−

C(5) 40 43.5

Refractory Ag

−

W(20) 240 26–28

metal

↓

compounds Ag

−

W(80) 80 42

−

WC(40) 130 24–30

↓

−

WC(80) 470

Composite made by inﬁltration of liquid silver into a tungsten

skeleton

Fig. 3.1-213 (a) Density, (b) hardness, and (c) electrical

conductivity of Ag

−

C alloys [1.231, p. 44f.]

Graphite (at. %)

10 20 30 40 50

048121620

Graphite (vol. %)Density (gcm

–3

)

Calculated Extruded

material

Pre-pressed, sintered,

pressed at 40 kNcm

–2

Vickers hardness HV10

Electrical conductivity

Extruded

material

Pre-pressed, sintered,

pressed at 40 kNcm

–2

Extruded

material

Pre-pressed, sintered,

pressed at 40 kNcm

–2

Part 3 1.10

Metals 1.10 Noble Metals and Noble Metal Alloys 347

3.1.10.2 Gold and Gold Alloys

Application

Gold and gold alloys are used for electrical contacts,

bonding wires and conductor paths in semiconduc-

tor devices, chemical and corrosion resistant materials,

thin surface coatings for optical and heat reﬂecting

mirrors, special thermocouples, and catalysts for or-

ganic chemical reactions. Classical applications are

jewelry, dentistry, monetary bars, and coins. Com-

mercial grades: Table 3.1-165. The purity grades of

gold bars are standardized in the range of 99.9to

99.999 wt% (ASTM B 562-86), Tables 3.1-165, and

3.1-166 [1.217].

Production

Elementary gold is extracted from ores by cyanide

leaching and precipitated with zinc, and by electroly-

sis. Reﬁning is achieved by application of chlorine gas

up to 99.5%,andto99.9% and higher by electroly-

sis. Bars, sheets and wires are made by casting, rolling

and drawing; powder is formed by chemical and by elec-

trolytic precipitation from solutions; and nanocrystalline

powders are formed by dispersion in organic solutions.

Coatings are produced by cladding; electroplating; and

applying powder preparations followed by ﬁring. Thin

ﬁlms are produced by evaporation and cathode sput-

tering. Very ﬁne gold leaves are made by traditional

hammering to a thickness of ∼ 0.2µm, or by cathode

sputtering.

Phases and Phase Equilibria

Selected phase diagrams are shown in Figs. 3.1-214–

3.1-223 [1.245, 246]. Continuous solid solutions are

Table 3.1-165 Speciﬁcations of ﬁne gold [1.217, p. 52]

Designation Grade (wt%) Impurity Maximum content (ppm)

“Good delivery” gold 99.5 any, total 5000

Fine gold 99.99 Ag/Cu/others/total 100/20/30/100

Fine gold, chemically pure 99.995 Ag/others/total 25/25/50

Fine gold, high purity 99.999 Ag/Fe/Bi/Al/Cu/Ni/Pd +Pt/total 3/3/2/0.5/0.5/0.5/5/10

Table 3.1-166 Standard ﬁneness of noble metal alloys and corresponding carat of jewelry [1.217, p. 52]

Fineness (wt‰)

Au 375 585 750 916,999

Ag 800,925,999

Pd 500 850,900,950,999

Pt 500 950,999

333 375 585 750 1000

Carat 8 9 14 18 24

1800

1700

1600

1500

1400

1300

1200

1100

1000

900

800

700

600

Co (at. % )

135 10 15 202530 405060

70 90

10 20 30 40 50 60 70 80 90

T (K) Co (wt %)

Au-Co

Magnetic

transformation

1337 K

24.8

(Au)

1768 K

1395 K

1269 K 98.1

(α – Co)

(ε – Co)

≈ 695K

Fig. 3.1-214 Binary phase diagram of Au

−

Co [1.245]

formed with Ag, Co, Cu, Fe, Ni, Pd, and Pt. Mis-

cibility gaps occur with Be, Ni, Pt, Rh, and Ru.

Thermochemical data are listed in Tables 3.1-167,

Part 3 1.10

348 Part 3 Classes of Materials

1400

1300

1200

1100

1000

900

800

700

600

500

400

Cu (at. %)

135 10 15 202530 40 5060

70 90

10 20 30 40 50 60 70 80 90

T (K) Cu (wt %)

Au-Cu

1337 K

1358K

1183 K

≈ 43.7

(Au, Cu)

Cu AuCu AuCu

683 K

658 K

663 K

(?)

558 K

513 K

38.5 K

Fig. 3.1-215 Binary phase diagram of Au

−

Cu [1.245]

1800

1700

1600

1500

1400

1300

1200

1100

1000

900

800

700

600

Ni (at % )

135 10 15 202530 405060

70 90

10 20 30 40 50 60 70 80 90

42.5

1083 K

70.6

T (K) Ni (wt %)

1337 K

Au-Ni

(Au, Ni)

1728 K

Fig. 3.1-216 Binary phase diagram of Au

−

Ni [1.245]

and 3.1-168 [1.217, 222]. Compositions, crystal struc-

tures and lattice parameters of selected intermetallic

compounds are given in Table 3.1-169 [1.217] and

in Figs. 3.1-224 and 3.1-225 [1.245]. Primary solid

solutions have the fcc structure of Au. The lattice pa-

rameters of the substitutional solid solutions correspond

roughly to Vegard’s law with a few exceptions [1.247].

2000

1800

1600

1400

1200

1000

800

600

400

200

Pd (at. % )

51015202530 405060

70 90

10 20 30 40 50 60 70 80 90

T (K) Pd (wt %)

Au-Pd

1828 K

1337 K

(Au, Pd)

1123 K

(Au

Pd)

1143 K

(AuPd

)

373 K

(AuPd(?)

Fig. 3.1-217 Binary phase diagram of Au

−

Pd [1.245]

2100

2000

1900

1800

1700

1600

1500

1400

1300

1200

1100

1000

900

800

700

Pt (at. % )

10 20 30 40 50 60 70 80 90

20 30 40 50 60 70 80 90

T (K) Pt (wt %)

2042 K

Au-Pt

1337 K

1533K

Fig. 3.1-218 Binary phase diagram of Au

−

Pt [1.245]

Part 3 1.10

Metals 1.10 Noble Metals and Noble Metal Alloys 349

Table 3.1-167 Thermodynamic data of Au [1.217, p. 107]

T (K) c

(J/K mol) S (J/K mol) H (J/mol) G (J/mol) p (at)

300 25.303 47.645 0.047 −14.247 6.87× 10

−58

500 26.158 60.757 5.188 −25.191 2.82× 10

−32

700 27.028 69.701 10.509 −38.282 2.49 × 10

−21

T = Temperature, c

= speciﬁc heat capacity, S = Entropy, H = Enthalpy, p = partial pressure of the pure elements

1800

1600

1400

1200

1000

800

600

400

Si (at. % )

135 1015203040507

10 20 30 40 50 60 70 80 90

T (K) Si (wt %)

1607 K

Au-Si

1337 K

16.6

(Si)

636 K

Fig. 3.1-219 Binary phase diagram of Au

−

Si [1.245]

T (K)

1400

1200

1000

800

600

400

200

Sn (at. % )

51015202530 40 50 60

70 90

10 20 30 40 50 60 70 80 90

Sn (wt %)

Au-Sn

(Au)

1337 K

6.8 1.4 756 K

17.5

18.5

9.1

≈ 23

463 K

551K

δδ

692 K

582 K

50.5 525 K 72

88.5

505 K

93.7

≈ 99.8

286 K

η (β - Sn)

(α – Sn)

4.90K

Fig. 3.1-221 Binary phase diagram of Au

−

Sn [1.245]

8020

20 40 60 80

Ag Cu

1050° C

1000°C

950°C

900°C

850°C

800°C

1050°C

1000 °C

950°C

wt %

Fig. 3.1-220 Liquidus sections through the miscibility gap

of the Au

−

Cu system [1.246]

Part 3 1.10

350 Part 3 Classes of Materials

T (K)

1337

1396 K

1445 K

(Au)

1728 K

1658 K

1768 K

1583 K

1668 K

1640 K

1943 K

1155 K

1105 K

2200

2000

1800

1600

1400

1200

1000

800

Ti (at. % )

1 3 5 7 10 15 20 30 40

50 80

10 20 30 40 50 60 70 80 90

Ti AuTi

Ti (wt %)

Au-Ti

(β -Ti)

(α -Ti)

(β -AuTi) (α-AuTi)

Fig. 3.1-222 Binary phase diagram of Au

−

Ti [1.245]

20 40 60 80

8020

Ag Cu

wt%

Miscibility gap

after solidification

350°C

400°C

500°C

600°C

700°C

Fig. 3.1-223 Isothermal sections through the miscibility

gap of the Au

−

Cu system [1.246]

Superlattice phases occur in alloys with Cd, Cu, Mn,

Pd, Pt, Rh, Ru, and Zn. The superlattice structures

have tetrahedral or rhombohedral symmetry. Typ-

ical compositions are AB

and A

B [1.218]. If they

are not precipitated as second phases, superlattice

Table 3.1-168 Heats, entropies and free energies of forma-

tion of Au compounds [1.222, p. 196]

Phase N

T H G S

(

◦

C) (J/mol) (J/mol) (J/K mol)

AuCu s.s. 0.58 500 5.32 9.67 5.65

Cu 0.26 25 4.03 4.90 2.97

AuCu I 0.50 25 8.96 8.96 −

AuCu II 0.50 400 6.03 8.79 4.10

AuCu

0.75 25 6.87 7.24 1.26

AuNi s.s. 0.53 877 −7.5 − 8.71

AuSn 0.50 25 14.24 − −0.4

= mole fraction of second compound,

∆S = entropy of formation, s.s. = solid solution

s.s. = solid solution

phases form antiphase domains on different sublattices

separated by antiphase domain boundaries. Intermetal-

lic compounds are formed with numerous elements

with different and complex crystal structures [1.225].

Metastable phases exist with Ni and Pt. Alloys with

B-metals form intermetallic phases at compositions

corresponding to e/a values of 3/2, 21/13, and 7/4

(Hume-Rothery phases). Structural types of intermetal-

lic compounds of gold with rare earth metals are listed

in [1.248].

Part 3 1.10

Metals 1.10 Noble Metals and Noble Metal Alloys 351

Table 3.1-169 Structure and lattice parameters of selected intermediate Au compounds [1.217, p. 113]

Phase Pearson Symbol a (nm) b (nm) c (nm) c/a Remarks Concentration (A/1−x )B(x)

AuAl mPs 0.6415 0.3331 0.6339

Al oP30 0.8801 1.6772 0.3219 LT 0.664–0.667

Al cP20 0.69208 LT

−

cF12 0.59973 0.334

AuCu oI40 0.3676 0.3972 773 K

AuCu oP8 0.456 0.892 0.283

AuCu tP4 0.3966 0.3673 0.9261 0.46–0.54

Cu cP4 0.39853

−

Pd cP4 0.3991 0.552

−

Pt cF4 0.3996 0.5

−

Sn hP2 0.29228 0.47823 1.6329 0.14

AuSn hP4 0.43218 0.5523 1.2779

AuSn

oC20 0.6502 0.6543 1.1705 475 K

Ti tI10 0.6485 0.4002 0.6171

LT = low-temperature modiﬁcation

0.42

0.40

0.38

0.36

0.34

Co (at. % )

40 60 80Au

0.42

0.41

0.40

0.39

0.38

0.37

0.36

20 40 60 80Au

Cu (at. % )

0.42

0.40

0.38

0.36

0.34

20 40 60 80Au Ni (at. % )

Lattice parameter a (nm)

Au-Co

fcc

Vegard’s law

Metastable

Au-Cu

T = 748 K

(Au, Cu)

Au-Ni

Vegard’s law

T = 298 K

(Au, Ni)

Fig. 3.1-224a–c Lattice parameter versus composition in

the systems

(a) Au

−

Co, (b) Au

−

Cu, (c) Au

−

Ni [1.245]

Part 3 1.10