• формат pdf
  • размер 15.89 МБ
  • добавлен 17 декабря 2011 г.
K?hler M. Etching in Microsystem Technology
Wiley-VCH, Weinheim, 1999, 368 pages.

Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all mode microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patteing of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices.
The microtechnical etching of functional pattes is a multidisciplinary area, the basis for the etching processes coming from chemistry, physics, and engineering.
The book is divided into two sections: the wet and dry etching processes are presented in the first, general, section, which provides the scientific fundamentals, while a catalog of etching bath composition, etching instructions, and parameters can be found in the second section. This section will enhance the comprehension of the general section and also give an overview of data that are essential in practice.

Distinctive Features of Microtechnical Etching.
Wet-Chemical Etching Methods.
Dry-Etching Methods.
Microforming by Etching of Locally Changed Material.
Chosen Recipes.
Смотрите также

Campbell S.A. The Science and Engineering of Microelectronic Fabrication

  • формат pdf
  • размер 25.07 МБ
  • добавлен 18 декабря 2011 г.
Oxford University Press, 2 edition, 2001, pages: 603. Ideal for upper-level undergraduate or first-year graduate courses and as a handy reference for professionals, The Science and Engineering of Microelectronic Fabrication, Second Edition, provides a thorough and accessible introduction to the field of microfabrication. Revised and expanded in this second edition, the text covers all the basic unit processes used to fabricate integrated circui...

Chang C.Y., Sze S.M. ULSI Technology

  • формат djvu
  • размер 7.17 МБ
  • добавлен 17 декабря 2011 г.
The McGraw-Hill Companies, 1996, 726 Pages. This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter...

Datta M., Osaka T., Schultze J.W. (Eds.) Microelectronic Packaging

  • формат pdf
  • размер 35.63 МБ
  • добавлен 17 декабря 2011 г.
CRC Press, 2005, 536 pages. Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metal...

Dziuban J.A. Bonding in Microsystem Technology

  • формат pdf
  • размер 20.81 МБ
  • добавлен 05 сентября 2011 г.
Springer, 2006. -349 p. (Springer Series in Advanced Microelectronics, vol. 24). This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has bee...

Gad-el-Hak M. (Ed.) MEMS: Design and Fabrication

  • формат pdf
  • размер 43.5 МБ
  • добавлен 18 декабря 2011 г.
CRC Press, Taylor & Francis Group, 2 edition, 2006, 647 pages. As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection of MEMS knowledge available, p...

Jan Korvink, Oliver Haber. MEMS: A Practical Guide to Design, Analysis, and Applications

  • формат pdf
  • размер 19.95 МБ
  • добавлен 26 марта 2010 г.
William Andrew Publishing, 2006, 992 p. MEMS, or microelectromechanical systems, claim to be the smallest functional machines that are currently engineered by humans. MEMS is an exciting field with rapidly growing commercial importance. When the field started, it was considered highly speculative, but early successes made researchers bold. Their enthusiasm spread to venture capitalists and eventually resulted in a range of commercially available...

Microwave Journal 2011 №02

  • формат pdf
  • размер 26.15 МБ
  • добавлен 10 июля 2011 г.
Contents: Ronen Holtzman, Elisra Electronic Systems Ltd. Emergence of microwave integrated circuit technology in multilayer radio frequency circuits as the chosen solution for small form and high functionality integrations. Phase Matrix Inc. Introduction to a series of microwave frequency synthesizers covering 0.1 to 10 GHz and 0.2 to 20 GHz. Chin-Leong Lim, Avago Technologies. Optimization of several design parameters to minimize internally gene...

Qin Y. Micromanufacturing Engineering and Technology

  • формат pdf
  • размер 16.42 МБ
  • добавлен 17 декабря 2011 г.
William Andrew, Elsevier, 2010, 414 pages. This book presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering. It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with a...

Tan C.S., Gutmann R.J., Reif L.R. Wafer Level 3-D ICs Process Technology

  • формат pdf
  • размер 14.31 МБ
  • добавлен 08 ноября 2011 г.
Springer, 2008. - 422 p. (Series in Integrated Circuits and Systems). Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researchi...

Wilson S.A. e.a. New materials for micro-scale sensors and actuators. An engineering review

  • формат pdf
  • размер 9.12 МБ
  • добавлен 11 марта 2011 г.
Materials Science and Engineering R 56 (2007) 1–129 (Elsevier B.V. ) This paper provides a detailed overview of developments in transducer materials technology relating to their current and future applications in micro-scale devices. Recent advances in piezoelectric, magnetostrictive and shape-memory alloy systems are discussed and emerging transducer materials such as magnetic nanoparticles, expandable micro-spheres and conductive polymers are i...