
© 1999 by CRC Press LLC
2.2.5 Outline of Fabrication
Most force sensors in use today or commercially available are manufactured either from silicon or
from silicon nitride. These two material systems are compatible with standard integrated circuit
processing techniques. The shape and the thickness are easily controlled with sub-100 nm precision.
This is necessary because the largest extension of the cantilevers is typically smaller than 300 µm.
Microfabrication techniques and batch processing are important prerequisites for any successful large-
scale production of force sensors.
The first published production recipe for cantilevers (Akamine et al., 1990) was for a sensor made of
silicon nitride. All silicon nitride levers available today are made more or less along the guidelines outlined
there. A silicon (100) wafer is thinned. Next, the tips are defined by masking the topside of the wafer
with oxide, leaving square openings with about 4-µm-long sides. They have to be oriented parallel to the
(110) directions. The silicon in these openings is attacked by the anisotropic etchant KOH. The etch
process is fastest parallel to the (111) surfaces. Therefore, a pyramidal-shaped depression is etched away.
Since the anisotropy of the etch rate is of the order of 100, the process slows down considerably once all
the sides of the pyramid meet. The etch process is then terminated.
In the next step the silicon nitride is grown on top of the silicon, on the side with the etch pits. The
thickness of the layer, together with the shape of the cantilever, determines the resonance frequency and
the compliance. Since the silicon nitride is grown, one has a very good control on the layer thickness.
Typically, cantilevers are 300 nm thick, or more. Calculated and experimentally verified spring constants
are of the order of 0.01 to 1 N/m. In a next step, Pyrex glass with openings for the cantilevers is bonded
from the topside onto the wafer. The remaining silicon is dissolved, leaving the cantilevers free. In the
last manufacturing step the cantilevers are coated with a thin reflective film, since most microscopes use
light reflected off the back of the cantilever to detect its deflection. Gold is usually used as the coating
material, together with a 1-nm layer of chromium as an adhesion layer.
The radius of curvature of silicon nitride cantilevers is limited to about 30 to 50 nm, because of the
manufacturing process. The imperfections of the etch pits and the filled-in silicon nitride limit the
sharpness. Silicon nitride tips can be sharpened during the production by thermal oxidation (Akamine
and Quate, 1992). Instead of directly depositing silicon nitride on the wafers with the pyramidal etch
pits, an oxide layer is deposited first. Then, the silicon nitride is added. When the oxide was removed
with buffered oxide etch, a sharpening effect was observed. Details of the process are described by the
inventors (Akamine and Quate, 1992). A second method is to grow in an electron microscope a so-called
supertip on top of the silicon nitride. It is well known that in scanning electron microscopes with a base
pressure of more than 10
–10
mbar hydrocarbon residues are present. These residues are cracked at the
surface of the sample by the electron beam, leaving carbon in a presumed amorphous state on the surface.
It is known that prolonged imaging in such an instrument degrades the surface. If the electron beam is
not scanned, but stays at the same place, one can build up tips with a diameter comparable with the
electron beam diameter and with a height determined by the dwell time. These tips are extremely sharp;
they can reach radii of curvature of a few nanometers. They allow therefore an imaging with a very high
resolution. In addition, they enable the microscope to image the bottoms of small crevasses and ditches
on samples. Unprocessed silicon nitride tips are not able to do this, since their sides enclose an angle of
90°, due to the crystal structure of the silicon.
Silicon nitride cantilevers are less expensive than those made of other materials. They are very rugged
and well suited to imaging in almost all environments. They are especially compatible to organic and
biological materials.
Alternatives to silicon nitride cantilevers are those made of silicon. The basic manufacturing idea is
the same as for silicon nitride. Masks determine the shape of the cantilevers. Processes from the
microelectronics fabrication are used. Since the thickness of the cantilevers is determined by etching
and not by growth, wafers have to be more precise as for the manufacturing of the silicon nitride
cantilevers.