
1322 Appendix B Selected Manufacturers’ Data Sheets
D
D
D
D
D
D
D
D
G
G
S
S
S
S
NC
8-SOIC
NDS9410
Single N-Channel Enhancement Mode Field Effect Transistor
General Description Features
These N-channel enhancement mode power field
effect transistors are produced using National’s
proprietary, high cell density, DMOS technology.
This very high density process has been especially
tailored to minimize on-state resistance, provide
superior switching performance, and withstand high
energy pulses in the avalanche and commutation
modes. These devices are particularly suited to low
voltage applications such as laptop computer power
management and other battery powered circuits
where fast switching, low in-line power loss, and
resistance to transients are needed.
• 7.0 A, 30 V. R
DS(ON)
= 0.03 Ω
• Rugged internal source-drain diode can eliminate
the need for an external Zener diode transient
suppressor
• High density cell design (3.8 million/in
2
) for
extremely low R
DS(ON)
• High power and current handling capability in a
widely used surface mount package
• Critical DC electrical parameters specified at
elevated temperature
ABSOLUTE MAXIMUM RATINGS T
C
= 25
°
C unless otherwise noted
Symbol Parameter NDS9410
Units
V
DSS
Drain-Source Voltage
V
DGR
Drain-Gate Voltage (R
GS
≤ 1 MΩ)
V
GSS
Gate-Source Voltage
I
D
Drain Current – Continuous @ T
A
= 25 °C
–
– Pulsed
P
D
Maximum Power Dissipation @ T
A
= 25 °C
T
j
T
STG
Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
R
qJA
(t )
R
qJA
Thermal Resistance, Junction-to-Ambient
(Pulse = 10 seconds)
Thermal Resistance, Junction-to-Ambient
(Steady-State)
30
30
±20
±7.0
±5.8
±20
V
V
V
A
A
A
W
°C
°C/W
°C/W
–55 to 150
2.5 (Note 1)
50
(Note 1)
100 (Note 2)
National
Semiconductor
Continuous @ T
A
= 70 °C
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