
1252 Part 3 Digital Electronics
16.85 (a) A 1 megabit memory is organized in a square with each memory cell
being individually addressed. Determine the number of input address lines
required for the row and column decoders. (b) If the 1 megabit memory is
organized as 250K words
× 4
bits, determine the minimum number of input
address lines required for the row and column decoders.
16.86 A 4096-bit RAM consists of 512 words of 8 bits each. Design the
memory array to minimize the number of row and column address
decoder transistors required. How many row and column address lines
are required?
16.87 Assume that an NMOS address decoder can source 250
μ
A when the output
goes high. If the effective capacitance of each memory cell is
C
L
= 0.8pF
and the effective capacitance of the address line is
C
LA
= 5pF
, determine
the rise time of the address line voltage if
V
IH
= 2.7V
.
Section 16.9 RAM Memory Cells
16.88 Consider the NMOS RAM cell with resistor load in Figure 16.74(b).
Assume parameters values of
k
n
= 80 μ
A/V
2
,
V
TN
= 0.4
V,
V
DD
= 2.5
V,
and
R = 1
M
. (a) Design the width-to-length ratio of the driver transistor
such that
V
DS
= 20
mV for the on transistor. (b) Consider a 16-K memory
with the cell described in part (a). Determine the standby cell current and
the total memory power dissipation for a standby voltage of
V
DD
= 1.2
V.
D16.89 A 16-K NMOS RAM, with the cell design shown in Figure 16.74(b), is to
dissipate no more than 200 mW in standby when biased at
V
DD
= 2.5V
.
Design the width-to-length ratios of the transistors and the resistance value.
Assume
V
TN
= 0.7V
and
k
n
= 35 μA/V
2
.
16.90 Consider the CMOS RAM cell and data lines in Figure 16.76 biased at
V
DD
= 2.5
V. Assume transistor parameters
k
n
= 80 μ
A/V
2
,
k
p
= 35 μ
A/V
2
,
V
TN
= 0.4
V,
V
TP
=−0.4
V,
W/L = 2
(
M
N1
and
M
N2
)
,
W/L = 4
(
M
P1
and
M
P2
)
, and
W/L = 1
(all other transistors). If
Q = 0
and
¯
Q = 1
, deter-
mine the steady-state values of
D
and
¯
D
after the row has been selected.
Neglect the body effect.
16.91 Consider the CMOS RAM cell and data lines in Figure 16.76 with circuit
and transistor parameters described in Problem 16.90. Assume initially that
Q = 0
and
¯
Q = 1
. Assume the row is selected with
X = 2.5
V and assume
the data lines, through a write cycle, are
¯
D = 0
and
D = 2.5
V. Determine
the values of
Q
and
¯
Q
just after the row select has been applied.
*16.92 Consider a general sense amplifier configuration shown in Figure 16.82
for a dynamic RAM. Assume that each bit line has a capacitance of 1 pF
and is precharged to 4 V. The storage capacitance is 0.05 pF, the reference
capacitance is 0.025 pF, and each is charged to 5 V for a logic 1 and to 0 V
for a logic 0. The
M
S
and
M
R
gate voltages are 5 V when each cell is
addressed and the transistor threshold voltages are 0.5 V. Determine the
bit line voltages
v
1
and
v
2
after the cells are addressed for the case when
(a) a logic 1 is stored and (b) a logic 0 is stored.
Section 16.10 Read-Only Memory
D16.93 Design a 4-word
×
4-bit NMOS mask-programmed ROM to produce outputs
of 1011, 1111, 0110, and 1001 when rows 1, 2, 3, and 4, respectively, are
addressed.
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